3D IC integration and packaging

publisher's note: products purchased from third party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product. A comprehensive guide to 3D IC integration and packaging technology 3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3d ic integration and packaging covers:  3D integration for semiconductor IC packaging  Through-silicon vias modeling and testing  Stress sensors for thin-wafer handling and strength measurement  Package substrate technologies  Microbump fabrication, assembly, and reliability  3D Si integration  2.5D/3D IC integration  3D IC integration with passive interposer  Thermal management of 2.5D/3D IC integration  Embedded 3D hybrid integration  3D LED and IC integration  3D MEMS and IC integration  3D CMOS image sensors and IC integration  PoP, chip-to-chip interconnects, and embedded fan-out WLP