Microelectronics Failure Analysis Desk Reference

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: * Failure Analysis Process Flow * Failure Verification * Failure Modes and Failure Classification * Special Devices (MEMS, Optoelectronics, Passives) * Fault Localisation Techniques: Package Level (NDT) * Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) * Deprocessing & Imaging Techniques: Deprocessing * General Imaging Techniques * Local Deprocessing & Imaging * Circuit Edit and Design Modification * Material Analysis Techniques * Reference Information: Important Topics for Semiconductor Devices * Failure Analysis Techniques Roadmap * Failure Analysis Operations and Management * Appendices: Failure Analysis Terms, Definitions, and Acronyms * Industry Standards